3D Microelectronic Packaging: From Fundamentals to by Yan Li, Deepak Goyal PDF

By Yan Li, Deepak Goyal

ISBN-10: 3319445847

ISBN-13: 9783319445847

ISBN-10: 3319445863

ISBN-13: 9783319445861

This quantity presents a accomplished reference for graduate scholars and execs in either academia and at the basics, processing information, and purposes of 3D microelectronic packaging, an pattern for destiny microelectronic applications. Chapters written through specialists conceal the latest examine effects and development within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complex fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. a number of photos, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth knowing of all facets of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability matters, universal mess ups, constructing components, and destiny demanding situations, supplying insights into key parts for destiny examine and improvement.

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Extra resources for 3D Microelectronic Packaging: From Fundamentals to Applications

Sample text

Additionally, some authors [40] have claimed that the Via First process allows for a fewer design constraints and a higher density of vias compared to the Via Middle and Via Last processes9. A key limitation of the Via First approach is that all the TSV materials and processes need to be compatible with CMOS processes and temperatures (~1200  C). Polysilicon vias are mostly used in the Via First process [41]. Bauer et al. [40] discuss a process where high density vias are created in a Via First process using a silicon as a sacrificial material during the initial via formation step.

K. S. Premchandran, L. C. H. J. Yap, A. Yu, A novel die to wafer (D2W) collective bonding method for MEMs and electronics a heterogeneous 3D integration, in Proceedings of the 60th Electronic Components and Technology Conference (ECTC), pp. 829–833, May 2010 56. K. S. K. L. Wright, B. S. C. Webb, J. J. K. J. R. U. Knockerbocker, 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 1 Introduction With the evolution of electronics towards increasingly energy-efficient, mobile, and high performance platforms, the requirements for packages with smaller formfactor, lighter weight and lower power, along with higher bandwidth and memory capacity, have been accelerating.

Guegen, C. Ventosa, L. Di Cioccio, H. Moriceau, F. Grossi, M. Rivoire, P. Leduc, L. Clavelier, Physics of direct bonding: applications to 3D heterogeneous or monolithic integration. Microelectron. Eng. 87, 477–484 (2010) 22. org/standards-documents/docs/jesd229-2 23. org/standards-documents/docs/jesd235a 24. S. Lhostis, A. Farcy, E. Deloffre, F. Lorut, S. Mermoz, Y. Henrion, L. Bethier, F. Bailly, D. Scevola, F. Gyuader, F. Gigon, C. Besset, S. Pellssier, L. Gay, N. Hetellier, M. L. Le Berrigo, S.

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3D Microelectronic Packaging: From Fundamentals to Applications by Yan Li, Deepak Goyal

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