By Yan Li, Deepak Goyal
This quantity presents a accomplished reference for graduate scholars and execs in either academia and at the basics, processing information, and purposes of 3D microelectronic packaging, an pattern for destiny microelectronic applications. Chapters written through specialists conceal the latest examine effects and development within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complex fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. a number of photos, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth knowing of all facets of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability matters, universal mess ups, constructing components, and destiny demanding situations, supplying insights into key parts for destiny examine and improvement.
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Stress, Compression, and Shear --
Introduction to Mechanics of fabrics --
Normal pressure and pressure --
Mechanical houses of fabrics --
Elasticity, Plasticity, and Creep --
Linear Elasticity, Hooke's legislations, and Poisson's Ratio --
Shear pressure and pressure --
Allowable Stresses and Allowable a lot --
Design for Axial a lot and Direct Shear --
Axially Loaded contributors --
Changes in Lengths of Axially Loaded participants --
Changes in Lengths of Nonuniform Bars --
Statically Indeterminate buildings --
Thermal results, Misfits, and Prestrains --
Stresses on susceptible Sections --
Strain power --
Impact Loading --
Repeated Loading and Fatigue --
Stress Concentrations --
Nonlinear habit --
Elastoplastic research --
Torsional Deformations of a round Bar --
Circular Bars of Linearly Elastic fabrics --
Nonuniform Torsion --
Stresses and traces in natural Shear --
Relationship among Moduli of Elasticity E and G --
Transmission of energy through round Shafts --
Statically Indeterminate Torsional contributors --
Strain power in Torsion and natural Shear --
Thin-Walled Tubes --
Stress Concentrations in Torsion --
Shear Forces and Bending Moments --
Types of Beams, quite a bit, and Reactions --
Shear Forces and Bending Moments --
Relationships among lots, Shear Forces, and Bending Moments --
Shear-Force and Bending-Moment Diagrams --
Stresses in Beams (Basic issues) --
Pure Bending and Nonuniform Bending --
Curvature of a Beam --
Longitudinal traces in Beams --
Normal Stresses in Beams (Linearly Elastic Materials).
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Extra resources for 3D Microelectronic Packaging: From Fundamentals to Applications
Additionally, some authors  have claimed that the Via First process allows for a fewer design constraints and a higher density of vias compared to the Via Middle and Via Last processes9. A key limitation of the Via First approach is that all the TSV materials and processes need to be compatible with CMOS processes and temperatures (~1200 C). Polysilicon vias are mostly used in the Via First process . Bauer et al.  discuss a process where high density vias are created in a Via First process using a silicon as a sacrificial material during the initial via formation step.
K. S. Premchandran, L. C. H. J. Yap, A. Yu, A novel die to wafer (D2W) collective bonding method for MEMs and electronics a heterogeneous 3D integration, in Proceedings of the 60th Electronic Components and Technology Conference (ECTC), pp. 829–833, May 2010 56. K. S. K. L. Wright, B. S. C. Webb, J. J. K. J. R. U. Knockerbocker, 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 1 Introduction With the evolution of electronics towards increasingly energy-efficient, mobile, and high performance platforms, the requirements for packages with smaller formfactor, lighter weight and lower power, along with higher bandwidth and memory capacity, have been accelerating.
Guegen, C. Ventosa, L. Di Cioccio, H. Moriceau, F. Grossi, M. Rivoire, P. Leduc, L. Clavelier, Physics of direct bonding: applications to 3D heterogeneous or monolithic integration. Microelectron. Eng. 87, 477–484 (2010) 22. org/standards-documents/docs/jesd229-2 23. org/standards-documents/docs/jesd235a 24. S. Lhostis, A. Farcy, E. Deloffre, F. Lorut, S. Mermoz, Y. Henrion, L. Bethier, F. Bailly, D. Scevola, F. Gyuader, F. Gigon, C. Besset, S. Pellssier, L. Gay, N. Hetellier, M. L. Le Berrigo, S.
3D Microelectronic Packaging: From Fundamentals to Applications by Yan Li, Deepak Goyal