Download e-book for kindle: Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin

By John Lau, Cheng Lee, C. Premachandran, Yu Aibin

ISBN-10: 0071626239

ISBN-13: 9780071626231

A finished consultant to 3D MEMS packaging equipment and strategies Written via specialists within the box, complicated MEMS Packaging serves as a helpful reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant offers state-of-the-art MEMS (microelectromechanical platforms) packaging recommendations, reminiscent of low-temperature C2W and W2W bonding and 3D packaging. This definitive source is helping you choose trustworthy, artistic, high-performance, strong, and cost-efficient packaging thoughts for MEMS units. The publication also will reduction in stimulating extra examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, methods, production, checking out, and reliability. one of the themes explored: complicated IC and MEMS packaging traits MEMS units, advertisement purposes, and markets greater than 360 MEMS packaging patents and 10 3D MEMS packaging designs TSV for 3D MEMS packaging MEMS wafer thinning, dicing, and dealing with Low-temperature C2C, C2W, and W2W bonding Reliability of RoHS-compliant MEMS packaging Micromachining and water bonding strategies Actuation mechanisms and built-in micromachining Bubble change, optical change, and VOA MEMS packaging Bolometer and accelerameter MEMS packaging Bio-MEMS and biosensor MEMS packaging RF MEMS switches, tunable circuits, and packaging

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Extra resources for Advanced MEMS Packaging (Electronic Engineering)

Example text

These 30 companies’ global sales totaled approximately $6 billion in 2007, representing approximately 80 percent of the global MEMS market. HP is the largest supplier, mainly supplying inkjet printheads, followed by TI, which mainly provides the digital light processor. For more information about these companies and many others, please see ref. 43. 5 Introduction to MEMS Packaging The MEMS device is not an isolated island. It must communicate with other integrated circuit (IC) chips in a circuit through an input/ output (I/O) system of interconnects.

57. “MEMS microphone packaging structure,” Pan, Zhengmin (CN), CN200994191 (Y)—2007-12-19. 58. “Multiple internal seal ring micro-electro-mechanical system vacuum packaging method,” Hayworth, Ken J. (US), Yee, Karl Y. (US) (+5), US2007298542 (A1)—2007-12-27. 59. “Method for forming a hermetically sealed cavity,” Witvrouw, Ann (BE), Rico, Raquel H. (ES) (+1), US2007298238 (A1)—200712-27. Introduction to MEMS 60. “Stacked die package for MEMS resonator system,” Gupta, Pavan (US), Razda, Eric (US), US2007290364 (A1)—2007-12-20.

15. “Package and packaging assembly of microelectromechanical sysyem microphone,” Huang, Chao-Ta (TW), Chien, Hsin-Tang (TW), US2008283942 (A1)—2008-11-20. 16. “Capacitance type micro-accelerometer,” Liu, Minjie (CN), Liu, Yunfeng (CN) (+2), CN101271125 (A)—2008-09-24. 17. “Silicon piezoresistance type pressure transducer encapsulation structure based on substrates,” Wang, Yuelin (CN), Wu, Yanhong (CN) (+2), CN101271029 (A)—2008-09-24. 18. “MEMS device support structure for sensor packaging,” Ahmad, Nazir (US), US2008277747 (A1)—2008-11-13.

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Advanced MEMS Packaging (Electronic Engineering) by John Lau, Cheng Lee, C. Premachandran, Yu Aibin


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